Cooler Master TD500 Mesh, Mid-Tower

Product Information

Dimensions (L x W x H): 499 x 210 x 500mm (incl. Protrusions), 430 x 210 x 477mm (excl. Protrusions) Mini ITX, Micro ATX, ATX, SSI CEB, E-ATX*, (*up to 12" x 10.7" motherboards, may impact cable management feature)

There are one or two minor negatives to the case that could become a problem if a more complex system is being built inside, but nothing majorly wrong that would stop me from using this case again. Most of the issues are due to the width of the case which is very narrow at just 210mm wide. There is only 19mm space for cable management on the right side, which is the bare minimum in our view.TD500 Mesh V2 features a new removable top panel to improve accessibility during system assembly and easier mounting of cooling hardware. The case also supports dual radiator installation up to 360mm long or up to 3 x 120 mm/2 x 140mm fan installation in both the front and top panels.

TD500 Mesh V2 is equipped with a Polygonal FineMesh front panel with a 3D effect contour design which is capable of providing high airflow and dust filtration, so there’s no need for an additional dust filter up front. Mini ITX, Micro ATX, ATX, SSI CEB, E-ATX*, (*support for up to 12" x 10.7", will limit cable management features) As well as three ARGB fans, Cooler Master includes an ARGB/Fan hub with the TD500 Mesh V2. The hub supports up to 4 fan header connections and 5 3 pin 5v ARGB connections with the front panel reset switch re-purposed to become an RGB control button. The hub also supports motherboard RGB control.MCB-D500D-KGNN-S01 (Mesh w/ Hub), MCB-D500D-KGNN-S00 (Mesh w/o controller), MCB-D500D-WGNN-S01 (Mesh White w/ Hub), MCB-D500D-WGNN-S00 (Mesh White w/o controller) Removing the front panel had little effect on CPU and GPU temperature, but as we often see, removing the side panel offered a slight improvement in both CPU and GPU temperature. Adding a rear fan had no positive effect on thermal performance. So in its default configuration, the case flows air well and is able to keep high-end components cool. One other thing worth mentioning is the RGB control button. Unlike most case RGB hubs that switch between a manual button and motherboard RGB control by holding in the RGB/Reset button for a few seconds, the Cooler Master RGB hub doesn’t have this capability. If you want to control RGB lighting with the switch you must not connect the motherboard header cable from the hub to the motherboard.

To look at the TD500 Mesh V2 you could easily mistake it for the original. In terms of the visuals not much has changed at all. It still has the Polygonal FineMesh front panel design, it comes with three CF120 ARGB fans pre-installed up front and features the Crystalline tempered glass side panel like the original. But there have been some subtle changes, the case is a little taller, the top panel is now removable, there's a cover for the PSU shroud window and USB type-C has been added to the front I/O panel. Firestrike is next, our gaming stand-in. The TD500 Mesh isn’t at the absolute top of the chart here, but it’s pretty close. 49C dT ties it with the P400A Mesh and gets it pretty close to the O11 XL again, although the larger temperature range reveals the SL600M’s advantage with an average of 46C dT. The 500DX averaged 53C dT in this test, giving the TD500 Mesh a slightly larger advantage than it had in the torture results. Standardized Fans Installing a system into the Cooler Master MasterBox TD500 V2 is a simple and pleasing process. Cooler Master has everything laid out in the correct positions, everything is where you would expect it to be. Alignment of PCIe slot cutouts, motherboard standoffs and fan screw holes etc are all good, nothing was difficult to install due to alignment issues, which can be a problem on some cheap chassis. Radiator Support: Top120mm/140mm/240mm/280mm/360mm, Front 120mm/140mm/240mm/280mm/360mm, Rear 120mmWith the GPU loaded instead, GPU temperature reached 22 degrees over ambient. This is tied with the SL600M and Lian Li O11 XL for best GPU temperature overall on the whole chart, both of which were tested with bottom intake fans pointed directly into the GPU. Without the full-system load of the torture test, GPU cooling is especiallly good, which is promising for the Firestrike Extreme result. Firestrike All temperature measurements are presented as Deltas – meaning the ambient temperature has been deducted from the CPU temperature giving us a Delta. Data shown in the charts represent the average component temperature over the length of the test as measured by HWiNFO and then the last 15 minutes of the data are calculated to get the average. The ambient temperature during thermal tests is between 20-22⁰C. Appearances were a top priority in the design of the TD500 Mesh: there are some areas where pennies have been pinched, and other areas where those pennies have been reinvested. We’ll start with the cost savings for contrast. The chassis itself is a design intended for reuse, which isn’t unusual or even bad, but it’s easy to tell from the vestigial remains of a 5.25” bay at the front of the case. We confirmed with Cooler Master that this body was an original creation for the TD500; the chassis will be reused for future cases, some of which may have ODD support--optical drives remain popular in the Japanese market, for example. Radiator support at the top of the case is better, with 120mm and 140mm mounts extending the whole length of the case. Clearance from the top edge of the motherboard to the top of the case is just 3cm, but the radiator/fan mounts are offset a bit towards the side of the case away from the motherboard. The distance from the motherboard tray to the 140mm mounting location is approximately 4cm, and that makes the distance to the 120mm mounting location approximately 6cm.

A full-cover power supply shroud with a front cut-out for long radiator installation and a PSU window with a removable cover allows the user to choose whether to show or keep the power supply hidden. Prior to load testing, we collect idle temperature results for ten minutes to determine the unloaded cooling performance of a case's fans and air channels. Thermal benchmarking is conducted for 1400 seconds (23 minutes), a period we've determined sufficient for achieving equilibrium. The over-time data is aggregated and will occasionally be compiled into charts, if interesting or relevant. The equilibrium performance is averaged to create the below charts. Find our noise normalized & fan normalized testing methodology here: https://www.gamersnexus.net/guides/3477-case-fan-standardization-tests-noise-normalized-thermals Thermals & Noise To simulate thermal demand we run the Cinebench R23 multi-thread benchmark and 3DMark Time Spy Extreme stress test simultaneously in a loop for 60 minutes to fully load the system. This gives the CPU and GPU enough time to reach constant steady-state temperature. With this data, we can compare how the system handles the thermal demand and measure peak noise levels.Cable management space is tight behind the motherboard tray. Cooler Master lists clearance as 1.9mm, but that’s the maximum depth, and in some locations clearance shrinks towards 1.5mm. The tie points next to the cable cutouts and the space under the PSU shroud make management possible, but the small amount of clearance combined with the already difficult-to-wrangle steel side panel aren’t fun to deal with. KitGuru says: A few minor changes to the chassis have certainly improved things compared to the original. However, it is still a fairly narrow ATX case which may compromise some builds. Will any of you guys be buying one?